High Performance Thermal Grese (HTK-002-U1)
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
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Suitable for CPU, chipsets on Mainboard, VGA card, etc.
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Easy to use.
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Zif Socket Templates ensure correct applying area with various CPU socket types.
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Produces an even layer when using applicator.
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Dielectric.
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Wide range of application temperature.
Specifications:
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Model
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HTK-002-U1
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Color
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White
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Specific Gravity
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2.37
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Viscosity/Flowability
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Nonflowing
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Thermal Conductivity
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0.8 watts/meter- °C
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Volume Resistivity
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5.0 x 1015
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Dielectric Constant
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4.4 at 100k Hz
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Dissipation Factor
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0.02 at 100k Hz
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Dielectric Strength
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550 volts/mil; 21.7 kV/mm
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Please verify the specifications at the time of purchase. No claim whatsoever would be accepted in case of specification error/mismatch, once the product is sold.
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